Update: TEI’19 has been scheduled to take place March 17-21, 2019 in Tempe, AZ (not during the the tentative dates proposed in our BID).
Our bid to host TEI 2019, the fourteenth International ACM Conference on Tangible, Embedded and Embodied Interaction at AME has been officially accepted!
We will host the conference in Tempe Arizona, a vibrant and growing Sonoran desert city. The main venue, the Tempe Mission Palms, is walking distance to the ASU Campus and in the heart of Tempe shops, bars, and galleries. The conference rooms, AV services, catering, palm courtyard, and rooftop pool reception deck will offer a flexible meeting space for academic and social gatherings during the conference. Phoenix is well known as an ideal winter destination, boasting average high temperatures in February ranging from 68 to 73 degrees Fahrenheit and a low chance of precipitation, while much of the rest of the northern hemisphere may be suffering from severe winter weather.
Our bid proposed the theme of Hybrid Materials with the aim of strengthening transdisciplinary tries across the tangible interaction, HCI, material sciences, social sciences, and arts communities. Gaining increasing momentum over the last five years, the material turn and its effect within HCI has generated development in numerous fields of interest to the TEI community.
Over the past few years, TEI research has increasingly embraced hybridity, whether through material explorations of composites such as bioelectronic, on-body, or active materials, or theoretical inquiries into socio-technical systems as hybrid assemblies. The theme of Hybrid Materials will continue to catalyze this exciting trend of tangible interaction research at the intersection of social, technical, biological, and artistic systems. Topics focusing on hybridity in interaction design include but are not limited to:
- active materials
- material as interface
- expressive computing
- human perception
- bioelectronic systems and interactions
- on-body computing
- new materialism
- computer as material
- sociotechnical assemblies
- design things
- seamful computing
- hybrid sense-making
- transdisciplinarity and HCI
- rapid prototyping
- participatory design
- productive tensions in design
Thanks to everyone who helped and contributed to our bid. On behalf of AME, we are really excited and very honored to host the conference in 2019!